Springa Road Show #3 – APAC Innovation Summit

The last leg report comes from the APAC Innovation Summit (4-8 June) at the Hong Kong Science and Technology Park, in Hong Kong.

AIS Robotics 
The APAC Innovation Summit, focused on robotics and Artificial Intelligence, had the aim to connect innovators in the ecosystem with government departments, investors and of course industrialists for adoption and application.
Since Springa it’s a spin-off of the Politecnico di Milano we were selected and invited to attend the two-days conference, and then, thanks to the organization of the Hong Kong Science and Technology Park, visit different Hong Kong robotics institutes and universities in the area.

Pitch presentation and business matching
During the second day the invited startups presented their projects in the classical 5 minutes elevator pitch in front of more than 200 people, coming from university, industry and investment fields. After, based on the interest, the attendance could reserve a 10 minutes slot to have a business match and talk deeper about the business idea with the entrepreneurs.

After the morning break the nice surprise was to find all the slots filled! We receive interest from both potential customers (local architects and interior designers) and from investors and industrial partners, especially regarding the chance to take advantage of the strategic position of Hong Kong as a bridge between western countries and China for the production and supply chain.

What we got from the Springa Road Show
The overall experience of the Springa Road Show has been great! We enjoyed a lot meeting so many people and companies in such a short time, with a great variety of cultural backgrounds. We got an incredible number of personal contacts and a very positive commitment from every country we saw.
We went home with the feeling that there are a lot of you waiting for Goliath, and this encourage us to work harder and reach the market as soon as possible.

Thank you all for the enthusiasm and stay tuned!

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